发明名称 |
Device package with a thermoplastic encapsulation cap and device encapsulation method |
摘要 |
In a device encapsulation method, an organic EL device is formed on a substrate. An encapsulation cap is placed on the substrate to surround the device and thereafter an end face of the cap is welded on at least the substrate. A device package is also disclosed.
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申请公布号 |
US7224119(B2) |
申请公布日期 |
2007.05.29 |
申请号 |
US20040953351 |
申请日期 |
2004.09.30 |
申请人 |
SAMSUNG SDI CO., LTD. |
发明人 |
ISHII IKUKO;SAKAGUCHI YOSHIKAZU |
分类号 |
H05B33/00;H05B33/04;H01L51/50;H01L51/52;H05B33/12;H05B33/14 |
主分类号 |
H05B33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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