ELECTRONIC PARTS PACKAGES

摘要

The present invention relates to an electronic part package capable of effectively radiating heat. A heat radiating member is buried below the mounting region of the light emitting device of the substrate so as to be separated from the mounting region of the light emitting device in a vertical direction, and is exposed to the lower surface of the substrate. A heat transfer member, which has thermal conductivity higher than that of the substrate, is formed between the mounting region of the light emitting device and the heat radiating member. Accordingly, since the substrate includes an effective heat radiating structure, it is possible to quickly radiate heat generated form the light emitting device.