<p>A two resist layer process allows a seed layer to be used to electroplate a conductive layer of an element in a way that a portion of the seed layer can be removed.</p>
申请公布号
WO2007059391(A2)
申请公布日期
2007.05.24
申请号
WO2006US60604
申请日期
2006.11.07
申请人
RCD TECHNOLOGY INC.;GARBY, SANDRA, M.;OBERLE, ROBERT, R.
