发明名称 CUTTING DEVICE OF SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To improve production efficiency by quickly transferring a substrate to a deburring process after cutting the substrate into pieces. SOLUTION: A high pressure water jet unit 70 provided with a nozzle 72 for performing deburring by jetting high pressure water to the substrate 1 (device 5) is arranged in a cutting area 50 of a cutting unit 60 for cutting the substrate 1 into pieces of devices 5. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007125667(A) 申请公布日期 2007.05.24
申请号 JP20050321785 申请日期 2005.11.07
申请人 DISCO ABRASIVE SYST LTD 发明人 TOGASHI KEN;KASAI YASUNARI;MASUMOTO MUTSUMI
分类号 B26F3/00;H01L21/301 主分类号 B26F3/00
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