发明名称 FIT COVER FOR HEAD PHONE
摘要 PROBLEM TO BE SOLVED: To solve a problem as described below by using head phones after mounting a fit cover to each of the head phones which include a type of a head phone to be used by holding at an entrance of an earhole and a type of a head phone to be used by inserting into the earhole. SOLUTION: The type to be used by holding at the entrance of the earhole 6 is configured by inserting the fit cover 2 providing a U shaped projected portion 5 into a mounting recessed/projected portion 4 of the head phone main body 1 so as to obtain internally an effective acoustic feeling by thinly forming ring state barrier ribs 3a, 3b, 3c to the head phone main body 1. The type to be inserted into the earhole 6 is configured by inserting the fit cover 2 which is thinly formed ring state barrier ribs 3a, 3b, 3d into the mounting recessed/projected portion 4 of the head phone main body 1 without forming the above mentioned U-shaped projected portion 5. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007129675(A) 申请公布日期 2007.05.24
申请号 JP20050348439 申请日期 2005.11.02
申请人 MAAKISU:KK;TEKKUSU:KK;ENDO HIROTAKA 发明人 KUWABARA MASAAKI
分类号 H04R1/10 主分类号 H04R1/10
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