发明名称 Methods of forming integrated circuit devices including raised source/drain structures having different heights
摘要 Integrated circuit devices including raised source/drain structures having different heights are disclosed. An integrated circuit device can include a first raised source/drain structure having a first height above a substrate in a first region of the integrated circuit including devices formed at a first density. The integrated circuit device can further include a second raised source/drain structure having a second height that is greater than the first height in a second region of the integrated circuit including second devices formed at a second density that is less than the first density.
申请公布号 US7220648(B2) 申请公布日期 2007.05.22
申请号 US20050200783 申请日期 2005.08.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM JI-YOUNG
分类号 H01L21/336;H01L29/78;H01L21/8238;H01L21/8239 主分类号 H01L21/336
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