SEALED PACKAGE WITH GLASS WINDOW FOR OPTOELECTRONIC COMPONENTS AND ASSEMBLIES INCORPORATING THE SAME

摘要

A package includes one or more optoelectronic components and a cap with an embedded glass window attached to a substrate. The optoelectronic com?onent(s) is supported by the substrate and is capable of detecting or emitting light through the glass window. The glass window may serve as an optical filter. Techniques are disclosed for fabricating a relatively thin package with an embedded glass window in the cap.