Board structure, a ball grid array (BGA) package and method thereof, and a solder ball and method thereof

摘要

A board structure, a ball grid array (BGA) package and method thereof and a solder ball and method thereof. The example solder ball may include a solder portion and a grooved connection portion, formed through a partitioning process, configured to fit a corresponding protruding portion on a board. The example BGA package may include a plurality of the example solder balls. The example board structure may include the example BGA package connected to the board via the grooved connection portions and the protruding portions.