| 摘要 |
An electrical circuit package comprises a ceramic substrate ( 1 ) with an electrical circuit pattern formed on one surface thereof, an opposite surface of the substrate being metallized, and an electrically conductive platelet ( 2 ) and a conductor body ( 3 ), arranged so that a first face of the platelet is soldered to the metallized surface of the substrate and an opposite face of the platelet is affixed in contact with the conductor body. A method of constructing the package is also described. |
