| 摘要 |
PROBLEM TO BE SOLVED: To provide a bump joining device and a bump joining method that can completely join a bump and an electrode part of a substrate with higher joining strength than before, and a semiconductor component manufacturing device. SOLUTION: The bump joining device is equipped with a vibration generating device 9, a voice coil motor 121, and a controller 110 and vibrates the bump with an ultrasonic wave up to a joining completion contact area from when the bump is pressed against the electrode part of the circuit board to reach an initial contact area, so the bump is completely joined with the electrode part as compared with convention cases wherein the bump is vibrated from when the joining completion contact area is reached, so higher joining strength than before can be obtained. COPYRIGHT: (C)2007,JPO&INPIT
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