| 摘要 |
According to one or more aspects of the present invention, a flip chip BGA packaging or mounting arrangement is disclosed where a grounding connection of implemented on the back of the chip. The grounding connection comprises one or more metal strips that are situated between the back of the chip and a printed circuit board upon which the chip is operatively coupled via BGA, or between that back of the chip and a heat spreader that is itself operatively coupled to the printed circuit board. The backside grounding connection enhances stability in switching applications, for example, particularly where the chip includes silicon on insulator (SOI) wafer processing.
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