| 摘要 |
A semiconductor device comprising a semiconductor chip ( 101 ) assembled on a first copper cuboid ( 110 ); the cuboid has sides of a height ( 111 ). The device further has a plurality of second copper cuboids ( 120 ) suitable for wire bond attachment; the second cuboids have sides of a height ( 121 ) substantially equal to the height of the first cuboid. The back surfaces of all cuboids are aligned in a plane ( 130 ). Encapsulation compound ( 140 ) is adhering to and embedding the chip, the wire bonds, and the sides of all cuboids so that the compound forms a first surface ( 140 b) aligned with the plane of the back cuboid surfaces and a second surface ( 140 a) above the embedded wires. For devices intended for stacking, the devices further comprise a plurality of vias ( 160 ) through the encapsulation compound from the first to the second compound surfaces; the vias are filled with copper, and the via locations are matching between the devices-to-be-stacked.
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