| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC package that efficiently releases heat and endures a severe heat environment, and its mounting structure. SOLUTION: This IC package is constituted such that an IC chip 2 is mounted and molded on a substrate 1. In this IC package, a bonding pad 4 is formed on an area adjacent to the IC chip 2 on the substrate 1, and the IC chip 2 is mounted in a way that it lies adjacent to the bonding pad 4. In addition, the bonding pad 4 is extended to edges of the substrate, and a heat release terminal 5 connected to both edges 4a of the extended bonding pad 4 is exposed to the edge face of the substrate 1. At mounting, heat release silicon 9 directly contacts with the heat release terminal 5 for heat transfer in a clearance to a metal plate 8. COPYRIGHT: (C)2007,JPO&INPIT
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