| 摘要 |
An inspection apparatus for semiconductor devices, comprising: a light irradiation means (22) for irradiating light to a surface of a semiconductor device (16), the surface having external connection terminals (12) formed thereon; an image pickup means (24) for picking up a plane image of the surface of the semiconductor device (16) by using an optical system (26) to provide an image data; and an inspection means (30) for inspecting misalignment of tips (14) of the external connection terminals (12) based on the image data. The external connection terminals (12) stand on, and are bonded to, electrode pads (10) of the semiconductor device (16) and are bent to crank shapes having respective middle portions laterally extending out of positions of the electrode pads (10). The irradiation means (22) irradiate light from a side opposite to the laterally extending middle portions of the external connection terminals (12) with respect to the electrode pads (10). <IMAGE> |
