LIGHT EMITTING DIODE PACKAGE AND METHOD THEREOF

摘要

The present disclosure provides a light emitting diode package including a substrate, a first electrode and a second electrode located on a first surface of the substrate, a plurality of light emitting diodes (LEDs) located between the first electrode and the second electrode, a plurality of retaining ring located on the first surface of the substrate. The LEDs are surrounded by the retaining ring therein. An encapsulation layer is mounted in the retaining ring and covers the LEDs therein. The encapsulation layer includes a first surface and an side surface extending from edges of the first surface. The side of the encapsulation layer contacts an inner surface of the retaining ring. The present disclosre also provides a method for manufacturing the above light emitting diode package.

主权项

1. A light emitting diode (LED) package, comprising:
a substrate having a first surface and a second surface located opposite to the first surface; a first electrode mounted on the first surface; a second electrode mounted on the first surface; a plurality of LEDs mounted on the first surface; a plurality of retaining rings formed on the first surface, each of the plurality of retaining rings surrounding a corresponding LED therein; and a plurality of encapsulation layer filled in the retaining rings and each of the plurality of encapsulation layers covering the corresponding LED therein.