| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a flip chip mounting method which is applicable to flip chip mounting of next generation LSIs and which is superior in productivity and reliability. <P>SOLUTION: While the connection terminal 11 of a circuit substrate 21 and the electrode terminal 12 of a semiconductor chip 20 are kept in contact with each other; the semiconductor chip 20 is arranged opposite to the substrate, and a resin 30 containing conductive particles is applied into a gap between the semiconductor chip 20 and the circuit substrate 21. The gap therebetween is made larger until it becomes a specified gap, thereby self-gathering the resin 30 between the facing terminals by boundary tension, and then the self-gathered resin 30 therein is cured. At this time, the assembly of the conductive particles included in the self-gathered resin 30 forms a connection body for electrically connecting the facing terminals. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
