| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for arranging electrodes of multiple minute electronic chip components in short time. SOLUTION: In the chip component arranging method, potential is added between a load plate 3 holding the minute electronic chip components 1 in a vertical or oblique position and an arranging plate 5 confronted with the load plate, and the chip components are made to vertically adhere to an adhesive tape face disposed along a face of the arranging plate. The electronic chip component arranging device is provided with a power supply device 12 adding potential between the load plate and the arranging plate, and the adhesive tape which makes the electronic chip components vertically adhere to a tape face disposed on the face of the arranging plate. An unpenetrating hole is formed in the load plate, and it is divided into a holder and a metal electrode plate. The holder is constituted of a partition plate and of a mesh-like wire net. COPYRIGHT: (C)2007,JPO&INPIT
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