| 摘要 |
<p>A transfer device (10) comprising a first support (11) for supporting chips (C) segmented by dicing a semiconductor wafer, and a second support (12) including a sheet (S) to which the chip (C) is to be transferred. The transfer device (10) is further provided with an expander (44) for radially expanding a dicing tape (DT), a camera (37) for detecting a gap between the chips (C) formed by expansion, and a section (17) for transferring each chip (C) to the sheet (S) on condition that the gap reached a set dimension.</p> |
