| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable package for mounting light emitting element, which is high in bonding strength between a mounting substrate and excellent in heat dissipating property. <P>SOLUTION: The package for mounting light emitting element is provided with an element mounting unit for mounting one or a plurality of light emitting elements, a wiring unit for supplying electric power to the light emitting elements, and connecting terminals at 5 places or more. The connecting terminals are bonded to the mounting substrate by the fillet of solder at the positions of connecting terminals. <P>COPYRIGHT: (C)2007,JPO&INPIT |
