| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape polishing apparatus capable of accurately polishing. SOLUTION: The tape polishing apparatus employs a polishing head 16 having a base area A<SB>total</SB>larger than a size of a protrusion defect 12 of a rib 11. Further, pressing force F (=P<SB>total</SB>×A<SB>total</SB>) applied by a compression spring 17 is predetermined such that pressing force P<SB>total</SB>per unit area when the entire bottom of the head 16 is pressed against the rib 11 is smaller than the minimum pressing pressure value P<SB>min</SB>with which the defect 12 and a material of the rib 11 can be polished. Thus, the rib 11 is prevented from being polished below a normal top surface 11a. COPYRIGHT: (C)2007,JPO&INPIT |
