发明名称 |
PRETREATMENT METHOD TO PLATING FOR POLYMER SUBSTRATE, PLATING METHOD, AND METHOD FOR PRODUCING MOLDING MADE OF THERMOPLASTIC RESIN |
摘要 |
PROBLEM TO BE SOLVED: To provide a pretreatment method to plating where a catalyst for plating included in an organometallic complex is efficiently infiltrated into each surface of various polymer substrates, and also, a plating film having higher adhesion is formed on the surface of each polymer substrate. SOLUTION: The pretreatment method to plating comprises: a surface modifying process where a first high pressure fluid in which a substance having an amide group is dissolved is brought into contact with a polymer substrate; and a catalyst applying process where a second high pressure fluid in which an organometallic complex containing a catalyst for plating is dissolved is brought into contact with the polymer substrate. COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007084929(A) |
申请公布日期 |
2007.04.05 |
申请号 |
JP20060227927 |
申请日期 |
2006.08.24 |
申请人 |
HITACHI MAXELL LTD |
发明人 |
NOMURA YOSHIYUKI;YUSA ATSUSHI;HIETA HARUMI;DAIMON HIDEO |
分类号 |
C23C18/30;B29C45/00;B29C47/08;B29K77/00 |
主分类号 |
C23C18/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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