WIRE-BONDED SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREOF

摘要

A method is provided by which the current carrying capacity of a semiconductor component (1; 25; 31; 35) having a standard package outline and a standard pin arrangement may be increased. The semiconductor component (1; 25; 31; 35) comprises a semiconductor device (2; 27) and a leadframe (3). A package layout (100) is defined and the orientation of the electrically conductive means (19, 20) with respect to a semiconductor device (2; 27) and inner contact area (15) of the leadframe (3) is altered so as to maximise the interfacial bonding area (23). The constraints of the standard package dimensions and the component assembly method are taken into account.