| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame which hardly deteriorates its adhesiveness to the sealing resin of a semiconductor device, is capable of keeping the reliability of the semiconductor device high, is capable of preventing the uppermost surface of its three layers subjected to a surface-roughening process, such as blast etc, from fading its surface-roughening effect away, improved in adhesive properties, has wire-bonding properties, and is capable of realizing a mounting work using a lead-free solder; and to provide its manufacturing method. SOLUTION: The lead frame has a layer configuration composed of a metal plate, a nickel film on the surface of a metal plate, a palladium film on the surface of the nickel film, and a gold film on the surface of the palladium film. These materials are provided in this sequence. The lead frame is used for a soldering operation that uses a lead-free solder, the nickel film is not uniform in layer thickness, and the palladium film and the gold film are uniform in layer thickness, respectively. The nickel film irregular in layer thickness has its surface subjected to wet-blast processing, so that its surface is roughened and improved in adhesive strength to sealing resin. COPYRIGHT: (C)2007,JPO&INPIT
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