| 摘要 |
A compact wireless IC tag incorporating a pressure sensor in an IC chip. The IC chip of the wireless IC tag has SOI structure comprising a silicon sheet layer, a silicon device layer which is formed on the upper side of the silicon sheet layer, and a thin silicon oxide layer having about 0.01 mum to 5 mum thickness sandwiched between the silicon sheet layer and silicon device layer. In the silicon device layer, a capacitive element of a pressure sensor comprising of a gap, and a first metal wiring and a second metal wiring respectively disposed on the upper and lower sides of the gap, is formed. In the silicon sheet layer on the lower side of the capacitive element, an aperture filled with rubber-like elastic material is formed.
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