发明名称 |
Halbleiterbauteil mit Halbleiterchip und Umverdrahtungslage sowie Verfahren zur Herstellung desselben |
摘要 |
The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall top side with the top side of the housing plastics composition. The rear side contact is led to the overall top side via a flat conductor sheet tape, so that the rear side contact of the semiconductor chip can be accessed from the overall top side. |
申请公布号 |
DE10352946(B4) |
申请公布日期 |
2007.04.05 |
申请号 |
DE2003152946 |
申请日期 |
2003.11.11 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
FUERGUT, EDWARD;WOERNER, HOLGER;VILSMEIER, HERMANN |
分类号 |
H01L23/50;H01L21/56;H01L21/60;H01L21/68;H01L21/98;H01L23/498;H01L25/065 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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