发明名称 Semiconductor device and method for fabricating the same
摘要 A method for fabricating a semiconductor device includes the steps of forming a high-k layer insulating layer on a SOI substrate; forming a gate electrode layer on the high-k insulating layer; forming a resist layer on the gate electrode layer; removing selectively the gate electrode layer using the resist layer as a mask; and removing the resist layer by an ashing process using a gas that does not comprise oxygen.
申请公布号 US2007072403(A1) 申请公布日期 2007.03.29
申请号 US20060526698 申请日期 2006.09.26
申请人 OKI ELECTRIC INDUSTRY CO., LTD. 发明人 SAKATA TOYOKAZU
分类号 H01L21/3205;H01L21/4763 主分类号 H01L21/3205
代理机构 代理人
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