| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve conductivity between a conductive body and the electrode of a substrate, in the electronic component mounted on the substrate or the like. <P>SOLUTION: In order to achieve an object, the electronic component is provided with a main body 1, a conductive body 6 provided on the lower surface of the main body 1 and consisting of a first metal, and a conductive body 7 provided on the surface of the conductive body 6 and consisting of a second metal. The conductive body 6 is provided with a recess 6A, and the recess 6A is filled by the conductive body 7. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
