发明名称 |
VERFAHREN ZUR PLANARISIERUNG VON OBERFLÄCHEN, DIE METALLE DER GRUPPE VIII ENTHALTEN, UNTER VERWENDUNG EINES FIXIERTEN SCHLEIFGEGENSTANDS |
摘要 |
A planarization method includes providing a Group VIII metal-containing surface (preferably, a platinum-containing surface) and positioning it for contact with a fixed abrasive article in the presence of a planarization composition, wherein the fixed abrasive article comprises a plurality of abrasive particles having a hardness of no greater than about 6.5 Mohs dispersed within a binder adhered to at least one surface of a backing material. |
申请公布号 |
DE60218218(D1) |
申请公布日期 |
2007.03.29 |
申请号 |
DE2002618218 |
申请日期 |
2002.12.17 |
申请人 |
MICRON TECHNOLOGY INC. |
发明人 |
SABDE, M. |
分类号 |
B24B7/20;B24B21/00;B24B21/04;B24B37/04;B24D11/00;C09K3/14;H01L21/304 |
主分类号 |
B24B7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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