| 摘要 |
Disclosed is a sputtering deposition device for depositing a thin film on a substrate. The sputtering deposition device comprises a substrate fixing part configured to fix a substrate; a target mounting member configured to mount a target and form an opening part on a front surface or a part of the top thereof; and a blocking shield provided on the top of the target mounting member. The present invention can minimize ion damage and heat damage of an organic thin film by blocking particles having strong energy and scanning the substrate in a horizontal direction.
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