METHOD FOR ASSEMBLING COMPONENTS AND COMPONENT DEVICES, CAPABLE OF REDUCING MECHANICAL STRESS APPLIED TO COMPONENTS BY REDUCING EFFECTIVE ELASTIC MODULE

摘要

In a process to assemble electronic components, e.g. semiconductor application specific integrated circuit or semiconductor sensors on a substrate or in a housing, the component (1) is joined to the substrate (2) surface (3) by an adhesive (4). The adhesive application leaves gas evacuation passages (5, 9) through which the interface may be exposed to a solder gas evacuation assembly.