发明名称 |
Supporting plate, apparatus, and method for stripping supporting plate |
摘要 |
A supporting plate which makes it possible to easily strip the supporting plate from a substrate in a short period of time after thinning the substrate. In the supporting plate to which a circuit-formed surface of a substrate is bonded with an adhesive, a first penetrating hole is formed in a substantially central portion of the supporting plate in the thickness direction, grooves connecting with the first penetrating hole are formed on a surface of the supporting plate to be contacted with an adhesive, and a second penetrating hole connecting with the grooves is formed in a peripheral portion of the supporting plate in the thickness direction.
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申请公布号 |
US2007062644(A1) |
申请公布日期 |
2007.03.22 |
申请号 |
US20060512566 |
申请日期 |
2006.08.30 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
NAKAMURA AKIHIKO;MIYANARI ATSUSHI;INAO YOSHIHIRO |
分类号 |
B29C63/00 |
主分类号 |
B29C63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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