PROCESS FOR PRODUCING EPOXY RESIN MOLDING MATERIAL FOR ENCAPSULATION, EPOXY RESIN MOLDING MATERIAL FOR ENCAPSULATION, AND ELECTRONIC PART OR DEVICE

摘要

A process for producing an epoxy resin molding material for encapsulation which comprises: a step in which raw materials comprising an epoxy resin, a hardener, and a filler are kneaded to obtain a composition; a step in which the composition is cooled to obtain a cooled composition; a step in which the cooled composition is pulverized to obtain a pulverized composition; a step in which inorganic fine particles having an average particle diameter of 50 nm or smaller are added; a step in which the pulverized composition is mixed with the inorganic fine particles to obtain a mixture; and a step in which the mixture is compacted, wherein the step of adding the inorganic fine particles comprises one or more of: (A) a step in which the fine particles are added between the step of obtaining a pulverized composition and the step of obtaining a mixture, (B) a step in which the fine particles are added between the step of obtaining a cooled composition and the step of obtaining a pulverized composition, and (C) a step in which the fine particles are added while pulverizing the cooled composition. In the process, the pulverized composition before compaction is prevented from aggregating during storage and the feeding is facilitated. Thus, tablet troubles caused by aggregates and troubles in electronic parts/devices encapsulated with the tablets can be diminished.