| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of soldering a printed circuit board that covers a melted solder with steam atmosphere, prevents the condensation of the steam from oxidizing the melted solder, and further prevents the oxidation of the melted solder with the steam atmosphere by using the fact that the steam forms a weak inert atmosphere. SOLUTION: The melted solder 2 is covered to prevent the oxidation, the steam is supplied from a supply inlet while maintaining the inside of a container at a temperature above the boiling point of water, and the inside is maintained at the atmospheric pressure by discharging the exhaust from an outlet 15 thereby to prevent the condensation of the steam and the oxidation of the melted solder 2. Soldering is performed in the steam atmosphere after condensation prevention heating is performed on the printed circuit board, and hot wind is immediately sprayed to accelerate drying thereby to prevent the condensation of the steam. COPYRIGHT: (C)2007,JPO&INPIT |
