发明名称 |
Structure Of Embedded Capacitors And Fabrication Method Thereof |
摘要 |
A new structure is provided to replace the existing common planar capacitor structure used in printed circuit boards. The conventional common planar capacitor structure utilizes a single dielectric layer and embedded capacitors with different capacitances are achieved by adjusting the sizes of the embedded capacitors' conductive terminals. Since general applications usually require capacitors whose capacitance range covers several orders of magnitude, these embedded capacitors have significant differences in terms of their conductive terminals' sizes. This will make the manufacturing process more complicated and difficult. The new structure combines inorganic material having a specific dielectric constant and polymer having another specific dielectric constant into a singulated non-overlapping coplanar capacitor structure that is easy to manufacture and provides better precision.
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申请公布号 |
US2007063243(A1) |
申请公布日期 |
2007.03.22 |
申请号 |
US20060550798 |
申请日期 |
2006.10.19 |
申请人 |
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发明人 |
YANG WEI-CHUN;CHANG CHIEN-WEI |
分类号 |
H01L27/108;H01L29/76;H01L29/94;H01L31/119 |
主分类号 |
H01L27/108 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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