发明名称 SUBSTRATE PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing device which realizes high safety by preventing leak of cleaning gas inside a processing chamber. SOLUTION: The device has a processing chamber 201 for processing a wafer held in a boat, a gas supply tube for supplying cleaning gas for cleaning the inside of the processing chamber 201 into the processing chamber 201, a gas exhaust tube for exhausting the processing chamber 201, a seal cap for opening and closing an opening 203 while carrying the boat to/from the opening 203 formed in the lower end of the processing chamber 201, a furnace shutter 260 for enabling the opening 203 to be closed when the seal cap unloads the boat from the processing chamber 201, and a closing auxiliary device 272 which works for supplementing closing force of the furnace shutter 260 for closing the opening 203. The closing auxiliary device 272 works for supplementing closing force of the furnace shutter 260 for closing the opening 203 at least when cleaning gas is supplied from the gas supply tube into the processing chamber 201. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007073746(A) 申请公布日期 2007.03.22
申请号 JP20050259374 申请日期 2005.09.07
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 KASAI TAKESHI;TANIYAMA TOMOSHI
分类号 H01L21/31;C23C16/44;H01L21/22 主分类号 H01L21/31
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