| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thick film circuit component comprising thick film electrode wiring which directly applies bonding connection, with a sufficient connection strength, to an aluminum wire to be connected with an electrode on a semiconductor chip. <P>SOLUTION: A thick film circuit component comprises: an insulated substrate 11; and thick film electrode wiring 12 disposed on the substrate, and the thick film electrode wiring 12 includes a bonding connection of an aluminum wire overlapping an Ag-Pt thick film 12a disposed in a lower layer, and an Ag-Pd thick film 12b disposed in an upper layer. The bonding connection is made by fusing and integrating the Ag-Pt thick film 12a and the Ag-Pd thick film 12b. <P>COPYRIGHT: (C)2007,JPO&INPIT |
