| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrolytic treatment device and an electrolytic treatment method where, even in the case of a substrate particularly having a large area, and in which a thin electrically conductive layer having high electric resistance is formed on the surface, a plating film having high plane uniformity in film thickness can be formed on the surface of the substrate. SOLUTION: The electrolytic treatment device comprises: a substrate holding part for holding a substrate W; a first electrode 88 contacted with the substrate W and energizing the surface of the substrate; a second electrode 98 arranged at a position facing the surface of the substrate W held by the substrate holding part; a porous structural body 110 arranged between the substrate W held by the substrate holding part and the second electrode 98 and having a pressure loss of≥500 kPa or an apparent porosity of≤19%; an electrolytic solution pouring part 104 of pouring an electrolytic solution between the substrate W held by the substrate holding part and the second electrode 98; and a power source 114 of applying voltage between the first electrode 88 and the second electrode 98. COPYRIGHT: (C)2007,JPO&INPIT
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