发明名称 |
A finned device for removing heat from an electronic component |
摘要 |
A device for removing heat from an electronic component, comprising a heat sink that can be coupled to the electronic component and conduct heat therefrom. A finned appurtenance coupled to the heat sink can transfer the heat into a fluid medium. The fins are oriented at an angle with respect to several flow streams of the fluid medium across the fins. Each flow stream follows a unique direction. |
申请公布号 |
GB2403601(B) |
申请公布日期 |
2007.03.21 |
申请号 |
GB20040013213 |
申请日期 |
2004.06.14 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
STEPHAN KARL BARSUN;ANDREW HARVEY BARR;ROBERT WILLIAM DOBBS |
分类号 |
F25D1/00;H05K7/20;F28F3/02;H01L23/36;H01L23/467 |
主分类号 |
F25D1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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