| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible substrate having improved heat dissipation. SOLUTION: This flexible substrate 10 comprises a supporting film 20, a wiring layer 30, a wiring layer 31, a resin layer 40, and a resin layer 41. The resin layer 40 and the resin layer 41 are filled with a particulate filler 50, respectively. The filler 50 is exposed at the surfaces of the resin layer 40 and the resin layer 41. The filler 50 with which the filled resin layer 40 is formed of a material having a thermal conductivity higher than that of the resin layer 40. Similarly, the filler 50 with which the filled resin layer 41 is formed of a material having a thermal conductivity higher than that of the resin layer 41. COPYRIGHT: (C)2007,JPO&INPIT
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