| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a tape carrier for TAB which can form a feed hole, while making it possible to form a conductive pattern which causes neither a short circuit nor disconnection easily, or to form a cover insulating layer which does not generate easily a pinhole. SOLUTION: A cover insulating layer 12 is formed such that a base insulating layer 2 is formed on a reinforcement layer 4, a conductive pattern 7 is formed on the base insulating layer 2, and the conductive pattern 7 is covered. After that, a feed hole 15 is perforated. Even if punched waste is produced when perforating the feed hole 15, it does not become a foreign substance in an exposure process at the time of forming the conductive pattern 7 and the cover insulating layer 12. Therefore, the feed hole 15 can be formed, at the same time by making it possible to form the conductive pattern 7 which causes neither a short circuit nor disconnection, and the cover insulating layer 12 which does not generate a pinhole by poor exposure resulting from the foreign substance. COPYRIGHT: (C)2007,JPO&INPIT
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