| 摘要 |
An LED having a bonded reflector is provided to simply fabricate an LED package having various kinds of sizes by separately forming a substrate to which a chip is bonded and a cup part functioning as a reflector and by bonding the substrate to the cup part. At least one LED chip(403) is bonded to a mount part(401). An interconnection part is formed in a manner that an n-side electrode and a p-side electrode of the LED chip are interconnection. A reflector part(402) is bonded to the mount part to reflect the light emitted from the LED chip, separated from the mount part. A groove is formed in the center of the mount part so that the LED chip is bonded to the groove. The LED chip is bonded as polygonal types like a quadrangle, a rhombus, etc. |
