| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high quality semiconductor package exhibiting excellent productivity and heat dissipation properties inexpensively without taking much labor, time or cost in manufacture. <P>SOLUTION: The semiconductor package 2 comprises an external connection terminal 12 connected electrically with a semiconductor element 10 through an electric connection 11, a resin mold portion 13 formed to have a predetermined external shape while embedding and sealing the semiconductor element and the electric connection, at least one recess 14 formed in the outer surface of the resin mold portion at a depth reaching the vicinity of the semiconductor element, and a heat dissipating portion 15 secured tightly to fill the recess in order to dissipate heat generated from the semiconductor element wherein the heat dissipating portion is composed of mixture resin paste produced by mixing thermally conductive filler and resin. <P>COPYRIGHT: (C)2007,JPO&INPIT |
