| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer expanding method which improves a yield without depositing a contaminant on the wafer surface and an expanding apparatus. SOLUTION: The expanding method includes a process of enlarging an interval between each chips T by expanding an adhesive sheet S applied on the back of the wafer W after a dicing work. The interval between each chips T is enlarged by expanding the adhesive sheet S after reversing the surface of the wafer W after being diced in the gravity direction. Consequently, the contaminant is prevented from depositing on the wafer W, and the wafer W expansion can be obtained with improved yield. COPYRIGHT: (C)2007,JPO&INPIT |
