发明名称 |
Low resilience film structures for producing low resilience films, e.g. release films, which can be crumpled up to facilitate disposal, are formed from extruded film layer(s), preferably by controlled cooling |
摘要 |
<p>A film structure for obtaining a low resilience film which can be crumpled up is formed from at least one extruded film layer. An independent claim is included for the production of the film structure, by subjecting a film structure to a defined cooling process after extrusion or coextrusion.</p> |
申请公布号 |
DE102005043590(A1) |
申请公布日期 |
2007.03.15 |
申请号 |
DE20051043590 |
申请日期 |
2005.09.12 |
申请人 |
HUHTAMAKI FORCHHEIM ZWEIGNIEDERLASSUNG DER HUHTAMAKI DEUTSCHLAND GMBH & CO. KG |
发明人 |
SCHIDT, WERNER |
分类号 |
C08J5/18;B32B7/02 |
主分类号 |
C08J5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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