| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for making complex back-face contacting of composition elements unnecessary by placing contact faces that are electrically connected with functional structural bodies on the same side of a functional wafer. SOLUTION: This component element is equipped with a cap wafer, consisting of the first silicon substrate 1 and thin glass substrate 2, and a functional wafer, consisting of the second silicon substrate 5, and on the functional wafer, an electrical contact face 6 is mounted. The cap wafer is linked to the functional wafer at glass substrate 2 through anodic bonding, while the electric contact face 6 is placed on the side of the functional wafer, facing the cap wafer. Meanwhile, the cap wafer has a notch, thereby providing an accession course 9, for direct approach to the electric contact face 6. COPYRIGHT: (C)2007,JPO&INPIT
|
