| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board which prevents mounted solder balls from being deformed and pads from being damaged before mounting, by controlling the structure so that the pads for mounting the solder balls as connection terminals on a wiring pattern may not be higher than just nearby regions. <P>SOLUTION: The printed circuit board has a wiring pattern including pads 20 for mounting solder balls as connection terminals provided on the wiring pattern. The pads 20 are composed of a conductor layer 14 forming the wiring pattern, a lower plating layer 16, and an upper plating layer 18 laminated in this order. Just the closet regions surrounding the pads 20 are composed of the conductor layer 14, at least the lower plating layer 16 between the lower and upper plating layers 16, 18, and a solder resist layer 22 laminated in this order. The upper plating layer 18 has a negligible thickness, compared with the thicknesses of the lower plating layer 16 and the solder resist layer 22, and the upside height of the pad does not exceed that of the just nearby region. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
