发明名称 |
SEMICONDUCTOR PACKAGE HAVING INTEGRATED METAL PARTS FOR THERMAL ENHANCEMENT |
摘要 |
A semiconductor device comprises a chip (101) mounted on a leadframe (103) beneath a central portion (110a) of a heat spreader (110). The heat spreader (110) has positioning members (110b) extending outwardly and downwardly from the central portion (110a) into grooves (106) of the leadframe (103). Encapsulation material (120) fills the void between the chip (101) and the heat spreader (110). Straps (105) received in grooves (106) hold tips (111) of the members 1 l0b against the pressure of the inserted encapsulation material (120). ® KIPO & WIPO 2007 |
申请公布号 |
KR20070027588(A) |
申请公布日期 |
2007.03.09 |
申请号 |
KR20067026546 |
申请日期 |
2006.12.15 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
COYLE ANTHONY L.;BOYD WILLIAM D.;HAGA CHRIS;SWANSON LELAND S. |
分类号 |
H01L23/40;H01L23/433;H01L23/495 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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