| 摘要 |
PROBLEM TO BE SOLVED: To enhance the adhesiveness of a film deposited on a substrate through a next film deposition by reliably removing deposits including a native oxide film. SOLUTION: A substrate treatment device 100 has a common conveying chamber 102 which is commonly connected to treatment chambers 104A-104D for conveying a wafer to/from each treatment chamber. The treatment chambers 104A-104D consist of a product generation chamber (a COR treatment chamber) for generating a product by performing the chemical reaction of deposits including a native oxide film on the wafer with gas elements, a product removing chamber (a PHT treatment chamber) for removing the product of the deposits on the wafer through the heat treatment, a Ti film deposition chamber for depositing a Ti film on the wafer, and a TiN film deposition chamber for depositing a TiN film on the Ti film. COPYRIGHT: (C)2007,JPO&INPIT
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