| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface-mounted LED package which is excellent in UV resistance and heat resistance, and high in light flux utilization rate and in luminance after mounting. <P>SOLUTION: The package is an LED package where a semiconductor light emitting element mounted on a resin board or a metal frame is covered with a transparent resin case. In the package, the resin board or the metal frame and the semiconductor light emitting element are bonded with a transparent or white adhesive. <P>COPYRIGHT: (C)2007,JPO&INPIT |
