| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase strength by executing reinforcement with copper foil or the like and to prevent deformation and peeling for conductive patterns formed on both surfaces of a substrate by increasing an area where the conductive patterns provided on a front surface and a back surface face each other across the substrate and reducing a place where external stress is coped with only by the substrate. <P>SOLUTION: The surface mounted LED comprises: an LED element; the substrate where the LED element is mounted; a front side electrode provided with both positive and negative poles and formed on the side where the LED element is mounted of the substrate; a back side electrode provided with both positive and negative poles, electrically connected to the corresponding electrode on the front side and formed on the opposite side of the side where the LED element is mounted of the substrate; a wire for electrically connecting the LED element and the front side electrode; and a mold part for covering at least a part of the LED element, the wire and the surface electrode. The positive/negative boundary of the front side electrode and the positive/negative boundary of the back side electrode do not practically overlap when viewing from a vertical direction to the substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT |
